Manipulation of Copper and Palladium Nanoparticle Size for Nuclear Science Applications – UROP Symposium

Manipulation of Copper and Palladium Nanoparticle Size for Nuclear Science Applications

Samer Ayache

Pronouns: he/him

Research Mentor(s): Mark Hammig
Research Mentor School/College/Department: Nuclear Engineering and Radiological Sciences / Engineering
Program:
Authors: Samer Ayache, Mark Hammig
Session: Session 3: 11:00 am – 11: 50 am
Poster: 8

Abstract

Metallic nanoparticles, when integrated with high-strength polymers, can be used to create lightweight, conductive and sustainable materials. Previous research demonstrated that gold (Au) and silver (Ag) nanoparticles could be grafted to an aramid nanofiber matrix (ANF) and form composites with ~10 % of the mass density of the equivalent bulk material. In this research, we show that copper (Cu) and palladium (Pd) nanoparticles can also be integrated into the composite. Copper is an economical alternative to the precious metals and Pd can be used to form metal hydrides for a variety of applications. These nanoparticles are created in a variety of aqueous hydrothermal chemical processes. We successfully modulated the Cu nanoparticle size via the reaction time. The growth of nanoparticles was monitored through UV-Vis spectroscopy (measures the absorbance of UV and visible light) and a Zetasizer (measures the size of nanoparticles in solution). By flowing solutions of nanoparticles through an organic film we create a network of nanoparticles that can illustrate unique properties. We are able to confirm the creation of nanoparticles by using electron microscopy. Copper nanoparticles are tested through a 4-point probe which can measure the material’s resistance. Through these measurements it was found that time was an important factor in determining nanoparticle size. Through a 20 hour period we could aim for particle size between 10 to 20 nanometers resulting in better performing solids. By creating copper and palladium solids we become closer to developing lightweight conductive materials comparable to copper wire.

Engineering, Interdisciplinary

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